Wafer dicing

Wikidata

https://www.wikidata.org/wiki/Q4388382

OpenAlex ID

https://openalex.org/C165013422 (API record)

OpenAlex Description

the process by which die are separated from a wafer of semiconductor following the processing of the wafer

OpenAlex Level [?]

3

Broader Concepts

• Layer (electronics)
• Wafer

Narrower Concepts

• Die preparation
• Package on package
• Wafer backgrinding

Associated Authors

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