Layer (electronics)
- Wikidata
- https://www.wikidata.org/wiki/Q6505497
- OpenAlex ID
- https://openalex.org/C2779227376 (API record)
- OpenAlex Description
- in electronics, a single thickness of some material covering a surface
- OpenAlex Level [?]
- 2
Broader Concepts
Narrower Concepts
- Adhesive
- Air layer
- Air permeability specific surface
- Aluminium foil
- Aluminum foil
- Anodic bonding
- Anti-corrosion
- Anti-reflective coating
- Antistatic agent
- Armour
- Atomic layer deposition
- Back end of line
- Bamboo charcoal
- Barrier layer
- Black silicon
- Boriding
- CZTS
- Chemical-mechanical planarization
- Cholesteric liquid crystal
- Composite film
- Contact region
- Contact resistance
- Copper indium gallium selenide solar cells
- Copper interconnect
- Copper wire
- Crystalline silicon
- Depletion region
- Diffusion barrier
- Diffusion layer
- Double layer (biology)
- Dual layer
- ETFE
- Electroforming
- Electroluminescence
- Electroplating
- Epitaxy
- Etching (microfabrication)
- GLARE
- Gallium nitride
- Galvanization
- Glass wool
- Hardening (computing)
- Heat sensitive
- High-refractive-index polymer
- Indium tin oxide
- Intrinsic semiconductor
- Ion milling machine
- Laminated glass
- Lamination
- Layer by layer
- Low emissivity
- Low-k dielectric
- Luminous efficacy
- Magnesium fluoride
- Magnetic memory
- Metal coating
- Metallizing
- Network layer
- Nitride
- Nitriding
- OLED
- Ohmic contact
- PEDOT:PSS
- Passivation
- Perovskite solar cell
- Phase-change memory
- Photon diffusion
- Photoresist
- Plastic film
- Plate electrode
- Polyethylene naphthalate
- Polyimide
- Polymer substrate
- Polyolefin
- Power cable
- Resist
- Semiconductor device
- Sheet resistance
- Shielding effect
- Silicide
- Silicon nitride
- Silver halide
- Solderability
- Solid wood
- Surface layer
- Tantalum nitride
- Thermal barrier coating
- Thermal insulation
- Thermal oxidation
- Thermal transfer
- Thermocompression bonding
- Thin film solar cell
- Thin layer
- Thin-film transistor
- Transition layer
- Transparent conducting film
- Transport layer
- Trench
- Tunnel magnetoresistance
- Vacuum deposition
- Wafer dicing
- Wetting layer
- Work function
- p–n junction
Associated Authors
- Alexandra Hamm
- Anthony C. Jones
- D. A. Streletskiy
- D. Pal
- Dominique Laniel
- Enrico Milanese
- Erin Hightower
- Fangqin Chen
- Gou Fujie
- Huaxin Gong
- Hugo Boulze
- I. Sumita
- Kazuki Yoshida
- Lior Suchoy
- M. Froment
- Mario D’Acquisto
- Modi ZHU
- Nipun Gunawardena
- Qian Gong
- Qiang Qiu
- Rachel Woods‐Robinson
- Ryota Hino
- Tianhaozhe Sun
- Wenzhen Sun
- Yifang Cheng
- Yusuke Ushijima
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