Wafer
flowchart
AA["Associated Authors (1)"]
C[Wafer]
BC["Broader Concepts (3)"]
NC["Narrower Concepts (16)"]
C== skos:broader ==>BC
NC== skos:broader ==>C
AA== dcterms:relation ==>C
click BC "#broader-concepts"
click NC "#narrower-concepts"
click AA "#associated-authors"
NI["add incoming edge"]
NO["add outgoing edge"]
NI-- ? -->C
C-- ? -->NO
click NI "#add-incoming-edge"
click NO "#add-outgoing-edge"
style NI stroke-width:2px,stroke-dasharray: 5 5
style NO stroke-width:2px,stroke-dasharray: 5 5
- Wikidata
- https://www.wikidata.org/wiki/Q267131
- OpenAlex ID
- https://openalex.org/C160671074 (API record)
- OpenAlex Description
- thin slice of semiconductor material used in the fabrication of integrated circuits
- OpenAlex Level [?]
- 2
Broader Concepts
Narrower Concepts
- Anodic bonding
- Black silicon
- Chip-scale package
- Direct bonding
- Fan-out
- Hybrid silicon laser
- Rapid thermal processing
- Reticle
- Semiconductor device fabrication
- Through-silicon via
- Wafer bonding
- Wafer dicing
- Wafer fabrication
- Wafer testing
- Wafer-level packaging
- Wafer-scale integration
Associated Authors
Add Incoming Edge
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Add Outgoing Edge
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