HelioWebWafer
- Wikidata
- https://www.wikidata.org/wiki/Q267131
- OpenAlex ID
- https://openalex.org/C160671074 (API record)
- OpenAlex Description
- thin slice of semiconductor material used in the fabrication of integrated circuits
- OpenAlex Level [?]
- 2
Broader Concepts
Narrower Concepts
- Anodic bonding
- Black silicon
- Chip-scale package
- Direct bonding
- Fan-out
- Hybrid silicon laser
- Rapid thermal processing
- Reticle
- Semiconductor device fabrication
- Through-silicon via
- Wafer bonding
- Wafer dicing
- Wafer fabrication
- Wafer testing
- Wafer-level packaging
- Wafer-scale integration
Associated Authors
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