Wafer
flowchart AA["Associated Authors (1)"] C[Wafer] BC["Broader Concepts (3)"] NC["Narrower Concepts (16)"] C== skos:broader ==>BC NC== skos:broader ==>C AA== dcterms:relation ==>C click BC "#broader-concepts" click NC "#narrower-concepts" click AA "#associated-authors" NI["add incoming edge"] NO["add outgoing edge"] NI-- ? -->C C-- ? -->NO click NI "#add-incoming-edge" click NO "#add-outgoing-edge" style NI stroke-width:2px,stroke-dasharray: 5 5 style NO stroke-width:2px,stroke-dasharray: 5 5
- Wikidata
- https://www.wikidata.org/wiki/Q267131
- OpenAlex ID
- https://openalex.org/C160671074 (API record)
- OpenAlex Description
- thin slice of semiconductor material used in the fabrication of integrated circuits
- OpenAlex Level [?]
- 2
Broader Concepts
Narrower Concepts
- Anodic bonding
- Black silicon
- Chip-scale package
- Direct bonding
- Fan-out
- Hybrid silicon laser
- Rapid thermal processing
- Reticle
- Semiconductor device fabrication
- Through-silicon via
- Wafer bonding
- Wafer dicing
- Wafer fabrication
- Wafer testing
- Wafer-level packaging
- Wafer-scale integration
Associated Authors
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Add Outgoing Edge
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